This part of IEC 62899 describes basic patterns to evaluate the electrical reliability of a conductive layer under mechanical deformation. Using the standard pattern described in this document, the comparison of the electrical reliability of a conductive layer under mechanical deformation is possible when the sample dimension is identical.
IEC 62899-202-9 Ed. 1.0 en:2023
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Printed electronics – Part 202-9: Materials – Conductive ink – Printed patterns for mechanical test
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